Automatic Inspection Equipment×アイビット - メーカー・企業と製品の一覧

IC wire bond / lead frame automatic inspection device LFX-1000

Automatic inspection of IC wire bonds and lead frame conditions! Inline X-ray inspection equipment.

The "LFX-1000" is an inline X-ray inspection device capable of fully automated inspection using a reflective type. It inspects the state of wire bonds and lead frames inside ICs with high speed and high precision. In addition, we also handle the transmission type "LFX-2000," as well as the reflective type automatic inspection device for reel-compatible IC wire bonds, "LFX-1000R," and the transmission type "LFX-2000R." 【Features】 ■ Automatically transports and inspects in the state of the lead frame, marking defective areas. ■ Capable of inspecting not only wire bonds but also metal foreign objects and lead frame pitch. ■ Lead frames can be set directly in the loader section or supplied via a magazine rack. *For more details, please refer to the PDF document or feel free to contact us.

企業：アイビット
価格：Other

X-ray inspection equipment

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X-ray wafer bump automatic inspection system 'Six-3000'

Transmitting X-rays to the voids inside the wafer! Automatically inspecting the quality of voids above the reference value.

The "Six-3000" is an automatic X-ray inspection device that inspects and determines bumps on wafers. It uses X-rays to penetrate voids inside the wafer and calculates the diameter (area) of the voids from the transmitted images, automatically determining the quality of voids exceeding the reference value. A micro-focus X-ray tube is used as the X-ray source, and an X-ray digital camera is employed for the X-ray detection part, allowing for the extraction of high-resolution images. This enables high-precision void inspection. Additionally, we also offer the silicon wafer crystal defect void inspection device "X-CAS-2." 【Features of Six-3000】 ■ An automatic X-ray inspection device that inspects and determines bumps on wafers ■ Uses X-rays to penetrate voids (bubbles) inside the wafer ■ Automatically determines the quality of voids exceeding the reference value ■ Uses a micro-focus X-ray tube as the X-ray source ■ Employs an X-ray digital camera for the detection part, extracting high-resolution images *For more details, please refer to the PDF materials or feel free to contact us.

企業：アイビット
価格：Other

X-ray inspection equipment

ブックマークに追加いたしました

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ブックマークを削除いたしました

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IC wire bond/lead frame automatic inspection device LFX-1000

It is an inline X-ray inspection device that automatically inspects the IC wire bond and lead frame condition.

This product is an inline X-ray inspection device capable of fully automated inspection, which inspects the condition of wire bonds and lead frames inside ICs with high speed and high precision. It automatically conveys and inspects the lead frame condition, marking any defective areas. In addition to inspecting wire bonds, it can also inspect for metal foreign objects and lead frame pitch. It can be connected to various types of loaders and unloaders. 【Features】 - Automatic conveyance and inspection in the lead frame condition - Capable of inspecting for metal foreign objects and lead frame pitch - Can be connected to various types of loaders and unloaders - Lead frames can be set directly onto the loader or supplied via a magazine rack *For more details, please refer to the PDF document or feel free to contact us.

企業：アイビット
価格：Other

X-ray inspection equipment

ブックマークに追加いたしました

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X-ray wafer bump automatic inspection system 'Six-3000'

Automated X-ray inspection device for inspecting solder bumps on wafers.

The "Six-3000" is an X-ray automatic inspection device that automatically inspects and judges bumps on wafers. It uses X-rays to penetrate voids (bubbles) inside the wafer, and from the transmitted images, it calculates the diameter (area) of the voids and automatically inspects whether the voids exceed the reference value. A micro-focus X-ray tube is used as the X-ray source, and a high-performance X-ray digital camera is employed for the X-ray imaging section, enabling the extraction of high-resolution images and allowing for high-precision void inspection. 【Features】 ■ High-resolution images can be extracted ■ High-precision void inspection is possible ■ High-speed inspection and inspection of small wafer bumps are possible *For more details, please refer to the catalog or feel free to contact us.

企業：アイビット
価格：Other

Semiconductor inspection/test equipment
X-ray inspection equipment

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Automatic Inspection Equipment×アイビット - メーカー・企業と製品の一覧

Automatic Inspection Equipmentの製品一覧

IC wire bond / lead frame automatic inspection device LFX-1000

X-ray wafer bump automatic inspection system 'Six-3000'

IC wire bond/lead frame automatic inspection device LFX-1000

X-ray wafer bump automatic inspection system 'Six-3000'